Exclusive: Samsung’s HBM Chips Encounter Issues in Nvidia Testing Due to Heat and Power Consumption Challenges
Samsung Electronics’ most recent high bandwidth memory (HBM) chips are encountering obstacles in passing Nvidia’s tests for integration into the U.S. company’s AI processors, according to three individuals briefed on the matter. These challenges are related to heat management and power consumption, particularly affecting Samsung’s HBM3 chips, the fourth-generation HBM standard widely used in graphics …














